本機是具有極細化光路設計的精密切割系統，針對線路板（FPC/PCB/FPCB）、FPM/CCM模組、TF卡、覆蓋膜等其他納秒鐳射加工產品， 具有高精度、無碳化、較低的熱影響及熱應力，切割效率高，穩定性好等特點 。
This machine is a precision cutting system with extremely thin optical path design. It has high precision and no carbonization for other nanosecond laser processing products such as circuit board (FPC/PCB/FPCB), FPM/CCM module, TF card, cover film, etc. Low heat impact and thermal stress, high cutting efficiency and good stability.
設備特點：
Ø採用大理石精密平臺：機構穩定性高、耐腐蝕、無形變、精度高；
Ø光源模組化設計：可根據不同產品應用搭配光纖、綠光、紫外等納秒級雷射器；
Ø高性能橋式運動平臺：Cycle Time效率更高，工作範圍廣，高速直線電機加工平臺；
Ø智慧視覺應用：CCD自動對位識別各類Mark點，自動聚焦，高精度識別系統；
Ø操作管理系統：產線操作監控，參數記錄、切割效率、加工情況、產能計算等功能；
Ø高精度光路系統：光束品質高，聚焦光斑小，切割品質高，低漂移的微米級切割精度；
Ø真空廢氣處理系統：真空平臺吸附腔體保證產品的平整性，減少產品熱效應和粉塵污染；
Ø安全防護系統：符合工業標準的鐳射防護結構，搭配安全光柵保護操作使用安全；
Ø便捷式軟體：自主開發的控制操作軟體，簡潔的操作介面，穩定性高；
Ø智慧化系統：自動對位，防呆報警，精度自動校正，自動聚焦，靈活應用等功能；
ØAdopting marble precision platform: high stability, corrosion resistance, no deformation and high precision;
ØModular design of light source: It can be matched with nanosecond lasers such as fiber, green light and ultraviolet light according to different product applications;
ØHigh-performance bridge motion platform: Cycle Time is more efficient, has a wide working range, and high-speed linear motor processing platform;
ØIntelligent vision application: CCD automatic alignment to identify various types of Mark points, auto focus, high-precision identification system;
ØOperation management system: production line operation monitoring, parameter recording, cutting efficiency, processing status, capacity calculation and other functions;
ØHigh-precision optical path system: high beam quality, small focused spot, high cutting quality, low drift micron cutting accuracy;
系統設計,機台規劃,製程開發,整線輸出 歡迎來電洽詢
業務經理 張先生 0933264536
Line : pabmike EMAIL：mike@buft.com.tw